As the AI computing power industry enters a fast-growth track, liquid cooling technology is undergoing a leap from the laboratory to commercial application, becoming key to solving heat dissipation challenges in high-power, space-constrained scenarios. Recently, the 2026 Cross-Strait (Kunshan) Artificial Intelligence Industry Development Conference was grandly held in Kunshan, featuring a series of industry seminars and industry chain supply-demand matchmaking sessions. The event brought together capital investors, leading OEMs, and supporting enterprises across the industry chain to jointly explore innovative development paths for the AI industry.

The industry event kicks off, jointly building an innovative ecosystem for the AI industry

On August 14, the Embodied Intelligence Industry Development Seminar and the "Yi" Home Entrepreneurs Club event were successfully held. With the theme of "Gathering Intelligence in Kunshan, Co-Shaping Embodied Intelligence," the event focused on cutting-edge technologies and industrial implementation in embodied intelligence, promoting capital to boost the development of the real economy. Leaders from the Kunshan Municipal Party Committee and Municipal Government, the head of Addor Capital, and representatives from more than 20 enterprises in the embodied intelligence industry chain gathered at the event.

Two supply-demand matchmaking sessions, revealing the real demands of the industry chain.

Xu Hong, a technical expert from Chuangkuo Technology

On the afternoon of August 16, the conference held two major supply-demand matchmaking sessions—one for the AI server industry chain and one for the intelligent connected vehicle industry chain—centered respectively on two key directions: "Intelligent Services Unite, Computing Empowers All Industries" and "Intelligent Connected Vehicles Connect Supply and Demand." Leading OEMs such as Inspur Information, Huawei, and EVOC Hi-Tech released real industry demands on site. Upstream and downstream enterprises across the industry chain gathered together to conduct face-to-face, targeted matchmaking.

Enterprises gave on-site presentations to jointly explore new opportunities for technological collaboration

At the AI server industry chain supply-demand matchmaking session, Chuangkuo Technology, as a representative of Kunshan's local high-end manufacturing enterprises, participated in the event and delivered special presentations on efficient cooling solutions for AI servers and vacuum diffusion welding processes for lithography equipment. In response to the industry's demands for high power consumption, high reliability, and the localization of precision equipment in the computing power sector, Chuangkuo Technology brought its core technologies in heat exchange and vacuum welding to engage in in-depth exchanges with OEMs and upstream and downstream supporting enterprises. The company exchanged technical ideas on computing power equipment cooling and vacuum welding for high-end semiconductor equipment, exploring opportunities for multi-party collaborative cooperation.

Rooted in local industry, empowering the high-quality development of high-end equipment

"Bringing upstream and downstream players of the industry chain to the same table—moving from 'what enterprises have' to 'what the market needs,' and from showcasing products to solving problems." Leveraging Kunshan's well-established manufacturing foundation, this supply-demand matchmaking session broke down information barriers, effectively connected both ends of supply and demand, and accelerated the deep integration of AI technology with the real economy.

Rooted in Kunshan, serving the high-end equipment industry. Chuangkuo Technology is deeply engaged in the R&D and manufacturing of heat exchange and vacuum diffusion welding technologies for the semiconductor and computing power equipment sectors. In the future, the company will continue to seize the window of opportunity in the AI industry, iteratively refine its core process technologies, actively participate in various industry chain collaboration platforms, and deepen exchanges and cooperation with industry chain partners—contributing local enterprise strength to the high-quality development of the computing power and semiconductor high-end equipment industries.