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Precision Microchannel Cold Plate
Microchannel structure design, vacuum diffusion bonding, excellent heat dissipation performance
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Custom Microchannel Cold Plates for Power Devices
Customized processing on demand, optimized flow channels, compatible with various power devices
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IGBT Heat Sink
Integrated liquid cooling structure, stable heat dissipation, capable of handling high-power loads
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Water divider
Professional testing tooling for precise detection of pressure drop performance in water-cooled plate flow channels
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Aircraft thin-walled curved skin radiator
Curved thin-walled structure, lightweight, high-reliability vacuum diffusion welding forming
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Precision Microchannel Heat Sink for Semiconductor Wafers
Millimeter-scale microchannels with low flow resistance, ensuring uniform wafer temperature control.
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Helium-Water Heat Exchanger
Fully diffusion-bonded, microchannel structure, outstanding heat exchange efficiency
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Vacuum Diffusion-Bonded Printed Circuit Heat Exchanger (PCHE)
Printed circuit heat exchange structure with precision flow channels, resistant to high temperature and high pressure.
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