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Vacuum Diffusion-Bonded Printed Circuit Heat Exchanger (PCHE)

Printed circuit heat exchangers (PCHE) are microchannel heat exchangers that use vacuum diffusion bonding to weld plates engraved with micron-scale flow channels into an integrated unit. With a gasket-free structure, they can simultaneously withstand high-temperature and high-pressure conditions. Their heat exchange area per unit volume is far greater than that of traditional shell-and-tube or plate heat exchangers, resulting in significantly reduced equipment volume. They are mainstream compact heat exchange equipment in high-end energy fields.

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Product Description
01
Core Advantages

❶Vacuum diffusion-bonded integral forming, gasket-free, completely eliminating gasket leakage risks.

❷Micron-level precision flow channels for high heat exchange efficiency, with equipment volume reduced by over 40% compared with traditional heat exchangers.

❸Withstands high temperature and high pressure, suitable for supercritical medium circulation conditions.

❹Material options include 316L stainless steel, titanium alloy, Hastelloy, and other corrosion-resistant materials.

❺Capable of complete closed-loop non-standard customization covering simulation, design, machining, and inspection.

02
Product Segments

BOG Plate-and-Shell Heat Exchanger, SCO₂ Heater, SCO₂ Recuperator, Intercooler.

03
Product Segments

Supercritical CO₂ Power Generation, Nuclear Energy, LNG-BOG, Hydrogen Energy, Semiconductor Cooling, Chemical Process Heat Exchange.

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