❶Integrally formed by precision machining with high flatness and stable positioning, ensuring the wafer remains fixed in position during the process.

❷Simulation-optimized plate surface micro-holes and cavity structures ensure uniform gas and liquid distribution, improving wafer coating and cleaning performance.

❸Supporting customized irregular and multi-station structures to fit customer machine installation space.

❹Material options include titanium alloy, stainless steel, and other materials, balancing high cleanliness and corrosion resistance requirements.

❺Supporting small-batch prototype R&D as well as large-scale standardized supply.

Titanium Alloy, Stainless Steel.

Wafer Cleaning, Vacuum Thin-Film Coating, Semiconductor Processes, Precision Optical Component Coating.

Overall dimensions, station layout, positioning structure, and plate surface micro-hole layout.